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RL170

主營生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

所屬分類:

產(chǎn)品關(guān)鍵詞:

計算機

通訊設(shè)備

汽車電子

關(guān)鍵詞:

普通FR-4 | 半固化片 | 無鉛兼容FR-4 | 無鹵兼容FR-4

產(chǎn)品描述

電子資訊工業(yè)近幾年來在中國的迅速發(fā)展下,結(jié)合各種相關(guān)產(chǎn)業(yè),已經(jīng)成為中國蓬勃發(fā)展、舉足輕重的新興產(chǎn)業(yè)。
江蘇諾德正是藉此信息產(chǎn)業(yè)化發(fā)展之平臺,以專業(yè)制造電子基礎(chǔ)材料為優(yōu)勢,于2007年開始建立銅箔基板生產(chǎn)基地,憑借優(yōu)秀的科技人才與創(chuàng)新的研發(fā)能力,配套發(fā)展生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。

nuode

RL170
 

 

(UL ANSI:FR-4.0)High-Tg Lead-Free /UV Blocking

 

特點            

  1. Tg ≥170℃無鉛兼容FR-4板材
  2. UV Blocking/AOI兼容
  3. 優(yōu)良的機械加工性能
  4. 優(yōu)秀的耐CAF性能

應(yīng)用領(lǐng)域            
計算機、通訊設(shè)備、汽車電子、工業(yè)控制用高檔儀器儀表等

 

 FEATURES     

  1. Tg ≥ 170 ℃ lead-free compatible FR-4 board
  2. UV Blocking/AOI Compatible
  3. Excellent machinability processability
  4. Excellent Anti-CAF Performance

 APPLICATIONS     
Computer ,  communication equipment ,  automotive electronics , precise apparatus and instrument , and etc.

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

IBS/IN

 

 

As received

A

≥8.0

12.7

After thermal stress

A

≥8.0

12.7

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.13

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

52

6. Flexural strength ,Minimum

 

Mpa

 

 

Length direction

A

≥415

550

Cross direction

A

≥345

480

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

120

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.7

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.016

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

≥170

172

13. CTI,V

TEC-112

V

≥175

200

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                Warpage of                                                                                                Warpage of

               (No-treating)                                                                                               (After treating:125℃ 2hr)

nuode                                                            nuode

            Peel strength

                 

  ※Specimen T hickness:1.6mm single side board

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

合作意向表

Cooperation Intent Form