LOW DK & DF
主營(yíng)生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。
所屬分類:
產(chǎn)品關(guān)鍵詞:
通訊設(shè)備
網(wǎng)絡(luò)設(shè)備
高頻測(cè)量設(shè)備
關(guān)鍵詞:
普通FR-4 | 半固化片 | 無(wú)鉛兼容FR-4 | 無(wú)鹵兼容FR-4
產(chǎn)品描述
電子資訊工業(yè)近幾年來(lái)在中國(guó)的迅速發(fā)展下,結(jié)合各種相關(guān)產(chǎn)業(yè),已經(jīng)成為中國(guó)蓬勃發(fā)展、舉足輕重的新興產(chǎn)業(yè)。
江蘇諾德正是藉此信息產(chǎn)業(yè)化發(fā)展之平臺(tái),以專業(yè)制造電子基礎(chǔ)材料為優(yōu)勢(shì),于2007年開始建立銅箔基板生產(chǎn)基地,憑借優(yōu)秀的科技人才與創(chuàng)新的研發(fā)能力,配套發(fā)展生產(chǎn)通訊設(shè)備、數(shù)碼家電、電腦等產(chǎn)品之主要電子基礎(chǔ)材料:銅箔基板,提供給客戶滿意的產(chǎn)品選擇與售后服務(wù)。
LOW DK & DF |
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Low Loss&High Heat Resistance Material |
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特點(diǎn)
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應(yīng)用領(lǐng)域 |
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FEATURES
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APPLICATIONS |
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GENERAL PROPERTIES |
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Test ltem |
Unit |
Test Method |
Treatment Condition |
Property Data |
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SPEC |
Typical Value |
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Thermal |
Glass Transition |
℃ |
DMA |
A |
>180 |
200 |
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Thermal |
ppm/℃ |
IPC-TM-650 |
Before Tg |
<60 |
45 |
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After Tg |
<260 |
210 |
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50-260℃ |
<3.0 |
2.6 |
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Decomposition Temperature,Td |
℃ |
IPC-TM-650 |
A |
>370 |
383 |
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Delamination |
Min |
IPC-TM-650 |
A |
>60 |
120 |
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Delamination Time,T300 |
Min |
IPC-TM-650 |
A |
>30 |
60 |
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Humidity |
Cycle |
/ |
85℃/85%RH,168hr |
>3 |
>10 |
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Dlelectrlc |
Dielectric |
/ |
IPC-TM-650 |
1GHz |
3.85 |
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SPDR,RC55% |
10GHz |
4.05 |
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Dissipation |
/ |
IPC-TM-650 |
1GHz |
0.0035 |
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SPDR,RC55% |
10GHz |
0.0068 |
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Physlcal |
Peel Strength, |
IBS/IN |
IPC-TM-650 2.4.8 |
288℃/10s |
>4 |
5.8 |
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Water Absorption |
% |
IPC-TM-650 2.6.2.1 |
\ |
<0.35 |
0.09 |
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Flammability |
/ |
UL94 |
A |
V0 |
V-0(Br) |
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Note: |
Dielectric Constant and Disspation Factor
PURCHASING INFORMATION |
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Thickness |
Copper foil |
Standard Size |
0.8mm to 3.4mm |
12μm to 105μm |
1041×1245mm(41″×49″) 940×1245mm(37″×49″) |
※ Other sheet size and thickness could be available upon request. |
合作意向表
Cooperation Intent Form